Pulsed plasma-enhanced chemical vapor deposition from CH<SUB>2</SUB>F<SUB>2</SUB>, C<SUB>2</SUB>H<SUB>2</SUB>F<SUB>4</SUB>, and CHClF<SUB>2</SUB> - NASA/ADS

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Pulsed plasma-enhanced chemical vapor deposition from CH₂F₂, C₂H₂F₄, and CHClF₂

Publication:: Journal of Vacuum Science Technology A: Vacuum Surfaces and Films
Pub Date:: March 1999
DOI:: 10.1116/1.581604
Bibcode:: 1999JVSTA..17..445L

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