This paper will consider the challenges facing linewidth metrology as devices shrink to the 100nm level and below, forcing all of us to 'thick small'. Significant improvements are needed in low voltage SEM resolution and measurement reproducibility. The applications of electrical probe metrology should be expanded through clever construction of test devices. Atomic force microscopy offers a novel way to measure feature size, as well as wall profiles and material thicknesses, but suffers from slow scan rates and data acquisition cycles. Advances in AFM need to address more rapid CD measurements and real-time imaging.
Metrology, Inspection, and Process Control for Microlithography XI
- Pub Date:
- July 1997