To describe and analyse a process of the surface cleaning by ion beams, a simple model based on the static TRIM92 code is presented and compared with the dynamic T-Dyn code. Although we have found a systematic shift between values based on TRIM92 and T-Dyn calculations, a combination of both methods made possible to analyse a process of removing ultra-thin carbon films from a copper surface. The simulation confirmed that to increase the efficiency of the cleaning process, the sputtering should be carried out at higher angles of incidence (60°-70°). The energy of the ion beam should be kept as low as possible to reduce a penetration of recoil carbon atoms into copper (at least during the final phase of the sputtering process). On the other hand, the sputtering yield corresponding to low ion energies may not be high enough to keep the etching process going on. Thus, the energy of 500-2000 eV seems to be a reasonable compromise between these two opposite requirements.