Lithography equipment is undergoing some of the most significant changes since the introduction of the wafer stepper. The driving force behind these changes is the diffraction limit of optics. The resulting characteristics of new lithography equipment, to contend with the diffraction limit, are discussed. The high cost of lithography equipment has made mix-and-match lithography commonplace. Step-and-scan technology is the wave of the near-future, as a way to contend with the difficulty of manufacturing wide-field lenses. Resist processing equipment will undergo few changes, but will often be integrated with steppers. Metrology is being stretched to its limits for technologies below 250 nm.
Technologies for Microlithography Manufacturing
- Pub Date:
- June 1995