Electronic systems in dense three-dimensional packages

A new packaging technology has been developed which permits the production of systems in a single miniature three-dimensional multichip module (MCM) and a prototype 'smart camera' has been developed as a technological demonstrator. The demonstrator is a complex microsystem incorporating standard commodity parts such as a camera chip, integrated circuits and discrete components. This smart camera has been produced in a lightweight, low-volume package. The packaging technique is scalable to a low-cost manufacturing process and offers improved electrical performance over conventional methods.