Thermosonic bond contacts with gold wire to YBa2Cu3O7 microstructures Burmeister, L. ; Reimer, D. ; Schilling, M. Abstract Publication: Superconductor Science Technology Pub Date: August 1994 DOI: 10.1088/0953-2048/7/8/006 Bibcode: 1994SuScT...7..569B