Polished coupler technology has developed several niches for prototype and breadboard applications, particularly for birefringent fiber. Applications include variable splitting ratio couplers, ultralow-loss devices, resonant rings and cavities, and evanescent-field-based devices. This paper will discuss the processing of polished couplers, including coupler substrate preparation, principal axis alignment, fiber-to-groove bonding, and substrate polishing. Coupler assembly, including adjustable, adhesive-bonded, optical contact bonded (OCB) designs, and resonator assembly will be described. Data from several spliced and spliceless resonators will be presented, including single-eigenstate-of-polarization, polarization rotating, and high-finesse devices.