Optical Interconnections and Wafer-Level Systems

Two important issues will greatly influence the success of mapping optical interconnections into future wafer-level distributed computing systems: (1) the co-integration of active and passive optical devices along side ULSI components, and (2) the scalability of optical networks and components to the wafer level. If these criteria can be met, planar integrated and free-space optics can potentially provide a very high performance communication network within the multi-wafer environment. For communication between wafers within a three dimensional wafer module, free space links can provide enhanced density and repairability over that obtainable with electrical methods. With the predominantly planar geometry and processing of wafer-level circuits, process compatible polymer optical waveguide arrays are especially attractive for providing intra-wafer passive connectivity. This dissertation presents the results of work investigating both vertical free-space and planar polymer waveguide array optical interconnections for wafer -level systems. Here, fabrication and measurements of the first 1.3mum wavelength experimental through-wafer optical interconnections using Fresnel phase plate lens arrays are given. In addition, the first index imaged poly(cyclohexylsilyne) thin film multimode optical waveguides are fabricated and characterized and the coupling behavior of arrays of these guides as a function of number of modes, density and routing is modeled and experimentally determined.