Integrated electrical/thermal component modeling
Abstract
An accurate way of electrically and thermally modeling components in PSPICE is presented and verified. This method uses electrically equivalent thermal models to interactively determine the model performance. By modeling device thermal characteristics with electrical analogs, the integrated thermal/electrical performance of the modeled devices can be predicted. The models will dynamically simulate individual device temperatures and electrical performance at the different temperatures. The integrated model can be used to analyze the electrical and thermal effects of device power dissipation, thermal interfaces, adjacent heat flux inputs, sink temperatures, cooling air temperatures, and flow rates. The simulation results show the accuracy of the model's predictions over a wide range of temperatures.
- Publication:
-
IECEC-90; Proceedings of the 25th Intersociety Energy Conversion Engineering Conference, Volume 2
- Pub Date:
- 1990
- Bibcode:
- 1990iece....2...78B
- Keywords:
-
- Computerized Simulation;
- Equivalent Circuits;
- Systems Simulation;
- Thermal Simulation;
- Diodes;
- Field Effect Transistors;
- Metal Oxide Semiconductors;
- Rc Circuits;
- Electronics and Electrical Engineering