Integrated optics approach for high-density optical interconnections in high-speed multichip IC packages
Abstract
The area requirements for routing and distributing guided-wave optical signals using gradual waveguide curves and branches will severely restrict the utilization of optical interconnects in future multichip IC packages. This paper addresses the use of total internal reflection in abrupt guided-wave optical components for realizing high-density optical interconnect circuits that eliminate this area constraint. Excess insertion losses of 0.2-0.5 dB have been measured at 830 nm for 90-deg waveguide corner bends, branches, and crossovers for both E(y) and E(x) polarizations in 5-micron- and 10-micron-wide multimode channels. These loss figures are expected to provide sufficient optical power margins for all point-to-point interconnects in a targeted high-speed multichip VLSI/GaAs package for signal processing applications.
- Publication:
-
Optoelectronic materials, devices, packaging, and interconnects
- Pub Date:
- March 1988
- Bibcode:
- 1988SPIE..836..343S
- Keywords:
-
- Electric Conductors;
- Integrated Circuits;
- Integrated Optics;
- Joining;
- Optical Waveguides;
- Thin Films;
- Attenuation;
- Etching;
- Fabrication;
- Microstructure;
- Optical Communication;
- Very Large Scale Integration;
- Electronics and Electrical Engineering