Diffusivity of Al in Ti and the effect of Si doping for very large scale integrated circuit interconnect metallization
Abstract
- Publication:
-
Journal of Vacuum Science Technology B: Microelectronics and Nanometer Structures
- Pub Date:
- May 1988
- DOI:
- 10.1116/1.584315
- Bibcode:
- 1988JVSTB...6..880N