VLSI technologists are fast developing wafer-scale integration. Rather than partitioning a silicon wafer into chips as is usually done, the idea behind wafer-scale integration is to assemble an entire system (or network of chips) on a single wafer, thus avoiding the costs and performance loss associated with individual packaging of chips. A major problem with assembling a large system of microprocessors on a single wafer, however, is that some of the processors, or cells, on the wafer are likely to be defective. This paper surveys practical procedures for integrating around such faults. The procedures are designed to minimize the length of the longest wire in the system, thus minimizing the communication time between cells. Although the underlying network problems are NP-complete, all the procedures can be proved reliable by assuming a probabilistic model of cell failure.
Massachusetts Inst. of Tech. Report
- Pub Date:
- May 1986
- Integrated Circuits;
- Systolic Arrays;
- Probability Theory;
- Electronics and Electrical Engineering