Basic development of a 1.5 micrometer very large scale integrated technique, part 1-4

The development of the basic processes of a VLSI technology for complex integrated circuits with smallest dimensions of 1.5 microns is described. Photolithography, including the development of equipment and technology for wafer steppers; techniques for structuring the different materials for wafer and mask production based on dry etching; and processes for mask making, including automatic defect control and adapted repair techniques are discussed. Digital signal processors for real time signal handling in audio and video applications, based on several autonomous processors, were developed.