Thermal conductance of metallic interface in vacuum

A review of the background, method of measurement, and results of thermal conductance of metallic interface in vacuum is presented. Accurate conductance measurements are required for materials used in intercepting and stopping intense radiation beams. Measurement results of thermal conductance as a function of contact pressure for copper, beryllium copper and a combination of the two with platinum/indium pieces inserted between the interface are given. It is found that the conductance rate depends considerably on the surface condition, the material properties, and the uniform contact pressure. It is also found that the conductance rate of beryllium copper, which increased by 30 percent with the insertion of a platinum pinhole piece, increases with an increase in contact pressure, but the rate is smaller when compared with copper alone due to a lower thermal conductivity and also a greater hardness of beryllium copper. As the hardness of the insertion piece decreases, the conductance increases considerably.