VLSI electronics: Microstructure science. Volume 9

Various topics concerning VLSI electronics are discussed. The topics considered include: MOS/bipolar technology tradeoffs for VLSI, critique of refractory gate applications for MOS VLSI, VLSI design tools and environments, VLSI standard part manufacturer as a full-service vendor, VLSIC assembly and packaging, high-speed transport in ultrasmall dimensions, and applications of thermal-wave physics to microelectronics. Also discussed are: surface acoustic wave devices, VLSI and single-chip software-oriented computer architecture, microelectronics for the intelligent building, the next generation of integrated circuits, transport in submicrometer devices, and fabrication and performance of very high-frequency devices.