Potential impact of VLSI technologies on guided missile design
Abstract
Some aspects of the anticipated impact of emerging VLSI technologies on tactical missiles, present and future generations are discussed. VLSI evolution represents a unique example of a very dynamic and pervasive trend in commercial and military applications. It is our opinion, however, that the characteristics of this trend are quite different in tactical missiles, not only compared to commercial electronics but even to strategic or space missiles. Considering the particular objectives and constraints as they seem common to most tactical guided missiles and smart munitions, the VLSI technologies should be almost tailored to this application. However, there are some perequisites to be considered to make the introduction of VLSIs successful. Here are some examples: careful planning to be in step with the maturity of the VLSI technology, sensible selection of targets for insertion or new designs and - quite importantly - consideration of program stability in terms of volume, rates, and changes. From a technical viewpoint alone, the current trend to light and small, 4- to 8-inch-diameter configuration whether ground or air-launched encourages an early insertion of VLSIs. Electronic packaging with unusual form factors, e.g., having a central hole for warhead effectiveness, high density and low weight, and low power dissipation, poses conflicting requirements to the missile designer. With very few exceptions, such as in magnetics or battery chemistry, the electronics sections cannot benefit from other technological breakthroughs. It is the evolution of monolithic large scale integration of circuits on Silicon and to a lesser degree on Gallium Arsenide which bears the main load to meeting these criteria of processing density at minimum power dissipation, and of providing an ever-increasing functional throughput. Those VLSI embodiments which appear to be most likely to influence missile electronics are defined. They may be divided into four categories, with some ranking indicated regarding their maturity and avaliability, as well as nonrecurring cost weight: (1) Memories (RAM and ROM); (2) Catalog special devices (ADC, DAC, (CP); (3) Semicustom (CGAs); and (4) Full custom.
- Publication:
-
In AGARD The Impact of Very High Performance Integrated Circuits on Radar
- Pub Date:
- August 1985
- Bibcode:
- 1985ivhp.agarT....M
- Keywords:
-
- Avionics;
- Missile Control;
- Missile Design;
- Tactics;
- Very Large Scale Integration;
- Computer Aided Design;
- Electronic Packaging;
- Gallium Arsenides;
- Electronics and Electrical Engineering