Heat pipe cooled electronic circuit card as applied to SEM FORMAT B standard
Abstract
Attention is given to the design and performance of novel heat pipe concept which increases power dissipation capability in the SEM FORMAT B Standard Module. The design employs the short conduction path of the module while maintaining both the existing component mounting area and thermal compatibility between the module and the heat sink interface. A twofold power dissipation capability increase over the existing conduction module.
- Publication:
-
American Institute of Aeronautics and Astronautics Conference
- Pub Date:
- July 1985
- Bibcode:
- 1985aiaa.confQ....C
- Keywords:
-
- Cooling Systems;
- Electronic Modules;
- Electronic Packaging;
- Heat Pipes;
- Network Synthesis;
- Acetone;
- Ammonia;
- Performance Prediction;
- Thermal Analysis;
- Fluid Mechanics and Heat Transfer