Silicon wafer cleaning for integrated circuit fabrication
Silicon wafers cleaned using different immersion methods were compared. The surfaces so produced were assessed. Results obtained after using these cleans are shown to be consistent with those described in the literature. The optimum clean is found to be that described by RCA (1970). This was adopted as a standard procedure and results are encouraging.
NASA STI/Recon Technical Report N
- Pub Date:
- November 1985
- Integrated Circuits;
- Surface Properties;
- Electronics and Electrical Engineering