New multiple sheet resistance technology for thin film circuits

A process has been developed to obtain thin film circuits having multiple sheet resistances for resistors. With additional levels of photoprocessing, the conductor underlayers of titanium and palladium can be processed into resistors having sheet resistivities of 1 and 10 ohms per square. This technology does not require changes to the standard metallization processes and conventional tantalum-nitride (Ta2N) resistor processing remains the same. The titanium-palladium resistors evaluated in this study are stable, well-behaved resistors having a large power dissipation capability; they can be laser trimmed to close tolerances. However, the higher Temperature Coefficient of Resistance (TRC) does limit their use in some circuit applications.