A wafer-scale digital integrator using restructurable VLSI
Abstract
Wafer-scale integration has been demonstrated by fabricating a digital integrator on a monolithic 20-sq cm silicon chip, the first laser-restructured digital logic system. Large-area integration is accomplished by laser programming of metal interconnect for defect avoidance. This paper describes the technology for laser welding and cutting, the design methodology and CAD tools developed for wafer-scale integration, and the integrator itself.
- Publication:
-
IEEE Transactions on Electron Devices
- Pub Date:
- February 1985
- DOI:
- 10.1109/T-ED.1985.21966
- Bibcode:
- 1985ITED...32..479R
- Keywords:
-
- Chips (Electronics);
- Computer Aided Design;
- Digital Integrators;
- Laser Welding;
- Very Large Scale Integration;
- Wafers;
- Block Diagrams;
- Fast Fourier Transformations;
- Joints (Junctions);
- Silicon;
- Electronics and Electrical Engineering