The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions
Abstract
A method for modeling the variations in defect levels in circuits produced on modern integrated circuit manufacturing lines is described in this paper. The effects on defect and fault distributions are derived. A deficiency in some previous yield models is eliminated.
- Publication:
-
IBM Journal of Research and Development
- Pub Date:
- January 1985
- Bibcode:
- 1985IBMJ...29...87S
- Keywords:
-
- Circuit Reliability;
- Defects;
- Failure Analysis;
- Integrated Circuits;
- Mathematical Models;
- Wafers;
- Density Distribution;
- Production Management;
- Statistical Analysis;
- Yield;
- Electronics and Electrical Engineering