An electrical analog for heat transfer through a randomly packed bed of spheres
Abstract
An electrical analog is used in this presentation of experimental results for the thermal conductivity of a randomly packed bed of spheres, where the only relevant heat transfer mode is conduction, in order to preclude the complications that inhere in the radiative and convective mechanisms present. Values of electrical resistance vs. load are first obtained for both a simple packing of cubic spheres and for an assembly consisting of one sphere in contact with two flat surfaces. Random packing is then considered.
- Publication:
-
AIAA, 19th Thermophysics Conference
- Pub Date:
- June 1984
- Bibcode:
- 1984thph.confS....H
- Keywords:
-
- Conductive Heat Transfer;
- Contact Resistance;
- Electrical Resistivity;
- Solid-Solid Interfaces;
- Thermal Conductivity;
- Loads (Forces);
- Modulus Of Elasticity;
- Monte Carlo Method;
- Packing Density;
- Poisson Ratio;
- Spheres;
- Fluid Mechanics and Heat Transfer