Design, development and test of a capillary pump loop heat pipe

The development of a capillary pump loop (CPL) heat pipe, including computer modeling and breadboard testing, is presented. The computer model is a SINDA-type thermal analyzer, combined with a pressure analyzer, which predicts the transients of the CPL heat pipe during operation. The breadboard is an aluminum/ammonia transport system which contains multiple parallel evaporator and condenser zones within a single loop. Test results have demonstrated the practicality and reliability of such a design, including heat load sharing among evaporators, liquid inventory/temperature control feature, and priming under load. Transport capability for this system is 65 KW-M with individual evaporator pumps managing up to 1.7 KW at a heat flux of 15 W/sq cm. The prediction of the computer model for heat transport capabilities is in good agreement with experimental results.