High density printed wiring by semi-additive manufacture
Abstract
This paper distinguishes between fully additive and semi-additive methods of manufacture and the need to formulate development contracts accurately to achieve the desired results. Recent significant work in fully additive and semi-additive manufacture is briefly discussed. The balance of the paper is devoted to a discussion of work recently completed for MICOM by General Dynamics Pomona Division on the 'Non-Planar Printed Circuit Program'. The Non-Planer Printed Circuit Program made use of additive and semi-additive techniques to fabricate millimeter wave antenna components, broad band spiral antennas, and an innovative cylindrical circuit board assembly.
- Publication:
-
IN: National Technical Conference
- Pub Date:
- 1984
- Bibcode:
- 1984samp.proc...17B
- Keywords:
-
- Antenna Design;
- Circuit Boards;
- Microwave Antennas;
- Network Synthesis;
- Printed Circuits;
- Adhesive Bonding;
- Electroless Deposition;
- Military Technology;
- Spiral Antennas;
- Sulfones;
- Wiring;
- Electronics and Electrical Engineering