Polyimide siloxane - Properties and characterization for thin film electronic applications
Abstract
Only a limited number of polyimides is currently available for use in microelectronics. The present investigation has the objective to provide data on a silicon containing polyimide which maintains the excellent properties of polyimides for electronic applications, while, in some respects, it is superior to commercial polyimides. This superiority is mainly related to adhesion properties and resistance to water. The polymer considered is a block copolymer of benzophenone dianhydride (BTDA) with methylene dianiline (MDA) and bis-gamma aminopropyltetramethyldisiloxane (GAPD). Attention is given to polyimide siloxane (SiPI) synthesis, surface planarization by polyimide siloxane, the adhesion of polyimide siloxane, its electrical properties, and its purity.
- Publication:
-
IN: Polyimides: Synthesis
- Pub Date:
- 1984
- Bibcode:
- 1984psca....2..847D
- Keywords:
-
- Dielectric Properties;
- Electronic Equipment;
- Polyimides;
- Siloxanes;
- Technology Utilization;
- Thin Films;
- Adhesion;
- Planar Structures;
- Purity;
- Solid Solutions;
- Surface Properties;
- Synthesis (Chemistry);
- Thermodynamic Properties;
- Volt-Ampere Characteristics;
- Electronics and Electrical Engineering