Reliability of polyimide in semiconductor devices
Abstract
The present investigation is concerned with relations regarding polyimide chemistry, water absorption monitored by weight gain, dielectric properties, and C-V analysis. Attention is given to the kinetics of cure, a mass spectroscopic analysis of outgassing products, surface I-V characterization, C-V characterization, humidity effects on polarization, water absorption/permeation, polarization effects versus polyimide chemistry, and polarization effects due to absorbed water. It is found that two major determinants of the reliability of polyimide in its use as an interlayer dielectric and passivant in integrated circuits are electric polarizability and water absorption.
- Publication:
-
IN: Polyimides: Synthesis
- Pub Date:
- 1984
- Bibcode:
- 1984psca....2..751S
- Keywords:
-
- Moisture Resistance;
- Organic Semiconductors;
- Polyimides;
- Polymer Chemistry;
- Semiconductor Devices;
- Thermal Stability;
- Curing;
- Dielectric Polarization;
- Dielectric Properties;
- Hygroscopicity;
- Integrated Circuits;
- Reaction Kinetics;
- Structural Weight;
- Volt-Ampere Characteristics;
- Electronics and Electrical Engineering