Mechanical locking between multi-layer printed wiring board conductors and through-hole plating
Abstract
This invention relates to the field of electrical printed wiring board structure and to the manufacture of such boards. A plated through-hole conductor structure for a multiple layer laminate electronic printed wiring board includes mechanical locking of the plated through conductor with textured conductor surfaces together with use of etching or other processing to provide laminate internal space for the mechanical locking structure. A manufacturing sequence and plural material selections are also disclosed.
- Publication:
-
Patent Application Department of the Air Force
- Pub Date:
- October 1984
- Bibcode:
- 1984pad..reptS....T
- Keywords:
-
- Circuit Boards;
- Electric Conductors;
- Holes (Mechanics);
- Locks (Fasteners);
- Perforated Plates;
- Plating;
- Printed Circuits;
- Sandwich Structures;
- Etching;
- Manufacturing;
- Openings;
- Patent Applications;
- Surface Roughness;
- Electronics and Electrical Engineering