Innovative technologies to miniaturize and enhance reliability of electronic equipments for space applications
Abstract
The paper shows how some applications of new microelectronic technologies based on ceramic materials can achieve miniaturization goals for space applications and how quality and reliability can be assured by an evaluation and qualification test program. The technologies considered comprise: chip and wire, chip carrier hybrid, chip carrier board, and custom or semicustom VLSI.
- Publication:
-
Lausanne International Astronautical Federation Congress
- Pub Date:
- October 1984
- Bibcode:
- 1984laus.iafcS....R
- Keywords:
-
- Chips (Electronics);
- Circuit Reliability;
- Electronic Equipment Tests;
- Microminiaturization;
- Spacecraft Electronic Equipment;
- Very Large Scale Integration;
- Astrionics;
- Ceramics;
- Quality Control;
- Reliability Engineering;
- Technology Utilization;
- Electronics and Electrical Engineering