RADC/NBS (Rome Air Development Center/National Bureau of Standards) Workshop. Moisture Measurement and Control for Semiconductor Devices, 3

Measurement problems in integrated circuit processing and assembly, and control of moisture in hermetically packaged semiconductor devices were examined. Thirty-four presentations are included which contain detailed information for securing hermetic packages with low moisture content. Agreement in measurement was obtained with the mass spectrometer for cerdip and metal packages at the 5000 ppmv level of moisture through the use of suitable moisture generators, a 3-volume calibrator, calibrated dewpoint hygrometers, and appropriate operational procedures. An approach is given for a reproducible and reliable transfer package. However, the increased use of organic materials in new and rapidly expanding technologies such as VLSI/VHSIC and hybrid packaging presents new and more complex challenges to accurate measurement of interior moisture.