Method for the fabrication of dielectric isolated junction field effect transistor and PNP transistor
Abstract
The process of fabricating a dielectrically isolated junction field effect transistor and a PNP transistor on a common substrate is described. An epitaxially layer is deposited on the base substrate to form the channel region of the junction field effect transistor. Impurities for the source and drain of the field effect transistor are diffused into the epitaxial layer. Impurities to form the gate are diffused into the epitaxially layer between the source and gate regions but separated therefrom. The PNP transistor which is dielectrically isolated from the field effect transistor by grooves, is formed by the diffusion into the base substrate of the respective impurities that form the base, collector and emitter regions of the PNP transistor.
- Publication:
-
Air Force Interim Report
- Pub Date:
- November 1984
- Bibcode:
- 1984aifo.reptU....C
- Keywords:
-
- Dielectric Properties;
- Epitaxy;
- Integrated Circuits;
- Jfet;
- P-N-P Junctions;
- Semiconductor Devices;
- Etching;
- Impurities;
- Junction Transistors;
- Patents;
- Polycrystals;
- Silicon Polymers;
- Electronics and Electrical Engineering