Transistor device techniques aid circuit designers, too

The present investigation is concerned with some practical examples which demonstrate an approach to the design of a microwave packaged transistor, giving particular attention to aspects of the microwave design. A similar design procedure can be used for a hybrid or integrated circuit configuration on alumina, epsilam-10, RT/Duroid 6010, or any other suitable substrate. Both the Smith chart and computer-aided design (CAD) facilitate design realization, taking into account the treatment of matching sections as either transmission lines or reactive elements. The first step in the considered design process involves the determination of the chip impedance and the plotting of impedance on a Smith chart. A considered example is concerned with an analysis of a typical transistor package metallization.