New surface-mounted package breaks from traditional MIC packaging

This package for hybrid and monolithic microwave integrated circuits promises to allow higher component density on microstrip PC boards, improved RF performance at frequencies up to 18 to 20 GHz, easy installation, compatibility with automated PC assembly, and increased reliability. It is comparable to the leadless chip carrier; that is, for many applications it supplants the universal dual-inline package for microprocessors and other digital and analog ICs. The package is built around an alumina or beryllia substrate on which thin-film circuit conductors and resistors are fabricated directly using standard thin-film deposition techniques.