Magnetic field assisted bonding of prefabricated grid to a Cu2S-CdS solar cell
Abstract
A new technique, the magnetic field assisted bonding is described for proper encapsulation of a thin-film Cu2S-Cds solar cell. This is made possible by using a thin layer of nickel coating on the substrate as the back-electrode. Results on the dependence of the series resistance, short-circuit current, open-circuit voltage, shunt resistance, diode ideality factor and fill factor on the magnetic field, the time and the temperature of application and coating of the grid are presented and discussed.
- Publication:
-
Electronics Letters
- Pub Date:
- March 1984
- DOI:
- Bibcode:
- 1984ElL....20..259D
- Keywords:
-
- Bonding;
- Cadmium Sulfides;
- Copper Sulfides;
- Encapsulating;
- Magnetic Fields;
- Solar Cells;
- Fabrication;
- Magnetic Effects;
- Open Circuit Voltage;
- Semiconducting Films;
- Temperature Dependence;
- Thin Films;
- Volt-Ampere Characteristics;
- Electronics and Electrical Engineering