The use of diamond core saws in the electronics industry

In the machining of material for semiconductors the aim is to keep wastage of this valuable material as low as possible. The so-called core saw was accordingly developed, which permits the cutting of very thin and accurately dimensioned wafers with very little wastage. This saw consists of a ring-shaped metal core plate which is coated by electrodeposition on the inside diameter with diamond grit and tensioned like a drum. Different saw blade and machine designs are described and recommendations concerning their use are made.