Electromigration tests on Sandia integrated circuits
Abstract
Accelerated aging studies were conducted on a Sandia produced integrated circuit, the ELA II test chip, to identify relevant aluminum metalization failure modes, and to delineate operating conditions which can adversely affect high reliability operation. Results from dc, ac and pulsed current tests show no significant long term reliability problems, and that the Sandia product is comparable to that produced by industry.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- March 1983
- Bibcode:
- 1983STIN...8335273A
- Keywords:
-
- Aging (Materials);
- Electromigration;
- Failure Modes;
- Integrated Circuits;
- Metallizing;
- Aluminum;
- Comparison;
- Fabrication;
- Pulses;
- Reliability;
- Silicon;
- Systems Analysis;
- Electronics and Electrical Engineering