EHF planar module for spatial combining

Because of the number of EHF anti-jamming terminals being considered by the military is large, there has been considerable interest in reducing the cost. It is pointed out that at the system level, the issue is one of payload complexity versus terminal effective incident radiated power (EIRP). Through an increase in the payload receiving terminal figure of merit, it is possible to bring the terminal EIRP down to the 50-60 dBW range. The design techniques of solid-state power amplifiers, which lend themselves to batch processing by photolithographic techniques, are of crucial importance in eventually lowering the manufacturing costs. The results of comparisons between various design approaches are presented. It is expected that batch processing using shielded microstrips will be successful in lowering the cost of the amplifiers. Active device characterization techniques, which are applicable to planar circuits, are described.