An appraisal of integrated circuit reliability prediction models
Abstract
The failure rate prediction models offered by the US MIL-HDBK-217 and the CNET Handbook of Reliability Data are critically reviewed. A composite stress weighting factor is proposed which comprises a weighted summation of Arrhenius terms corresponding to the main classes of failure mechanism and, for plastic encapsulation, acceleration factors for humidity. It is concluded that the CNET temperature weighting factor is the best simple expression available and a simple humidity weighting factor is proposed to augment the CNET model.
- Publication:
-
Reliability and Maintainability
- Pub Date:
- September 1982
- Bibcode:
- 1982rema.rept..483J
- Keywords:
-
- Circuit Reliability;
- Failure Analysis;
- Integrated Circuits;
- Prediction Analysis Techniques;
- Reliability Analysis;
- Electronic Packaging;
- Encapsulating;
- Humidity;
- Plastic Coatings;
- Temperature Effects;
- Weighting Functions;
- Electronics and Electrical Engineering