Ampoule sealing apparatus and process

An apparatus and process for sealing fused quartz ampoules housing a semiconductor growth charge under vacuum is described. An elongated fused quartz ampoule having an enlarged diameter open end and a reduced diameter closed end is vertically retained in a vacuum assembly. A semiconductor charge is disposed within the reduced diameter portion of the ampoule. A quartz plug of substantially the same diameter as the reduced diameter portion is suspended within the open and of the ampoule via a rotary vacuum feed. After evacuation of the ampoule a plug is lowered into the reduced diameter area and sealed therein while maintaining the vacuum on the ampoule. The charged ampoule area is then separated from the remaining structure by breaking along the scored line.