High density circuit technology
Abstract
A multilevel metal interconnection system for very large scale integration (VLSI) systems utilizing polyimides as the interlayer dielectric material is described. A complete characterization of polyimide materials is given as well as experimental methods accomplished using a double level metal test pattern. A low temperature, double exposure polyimide patterning procedure is also presented.
- Publication:
-
Final Contract Report Mississippi State Univ
- Pub Date:
- March 1982
- Bibcode:
- 1982msu..reptR....W
- Keywords:
-
- Dielectrics;
- Passivity;
- Polyimides;
- Very Large Scale Integration;
- Adhesion;
- Coatings;
- Fabrication;
- Integrated Circuits;
- Low Temperature;
- Mechanical Properties;
- Microelectronics;
- Wafers;
- Electronics and Electrical Engineering