Low-temperature void formation in gold-aluminum contacts
Abstract
Recent work has been presented which indicates voids forming in either aluminum to gold wirebonds or gold to aluminum wirebonds at temperatures below 2000 C are studied. The rate and extent of void formation at low temperatures (1250 C and 1500 C) and high temperatures (2250 C and 3000 C) using aluminum to gold and gold to aluminum wirebonds are compared.
- Publication:
-
Presented at the 32nd Electron. Components Conf
- Pub Date:
- 1982
- Bibcode:
- 1982elco.conf.....P
- Keywords:
-
- Aluminum Alloys;
- Bonding;
- Gold Alloys;
- Temperature Effects;
- Voids;
- Wire;
- Aging (Metallurgy);
- Electrical Resistance;
- Thickness Ratio;
- Electronics and Electrical Engineering