The effects of package integrity on DIP reliability

The paper outlines the methodology involved in testing chipped dual-in-line packages (DIP) and presents a factual case history of an analysis of the effects of chips on DIP reliability. It was found that 10% (15 of 150) of the chipped DIPs examined failed. The fine-leak test was selected as the overriding criterion because leaks in the DIP may adversely affect the reliability by allowing moisture to penetrate the cavity. A major finding of the study is that 24-pin packages appear not only to be more susceptible to chipouts, but to larger ones that result in leaks into the cavity.