The NPL Soldering Science and Technology Club: Its basis and its aims
Abstract
The activities of the Division of Material Applications are summarized emphasizing the contributions of the Surfaces and Interfaces section to metal forming technologies such as adhesive technology, diffusion bonding and friction welding as well as soldering. The origins, aims and benefits of the Soldering Science and Technology Club are described. Research goals in the printed circuit soldering technology are commented on.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- December 1982
- Bibcode:
- 1982STIN...8328327L
- Keywords:
-
- Organizations;
- Printed Circuits;
- Soldering;
- Technology Transfer;
- Technology Utilization;
- Adhesive Bonding;
- Friction Welding;
- Metal-Metal Bonding;
- Solders;
- Surface Properties;
- Electronics and Electrical Engineering