New Photolithographic methods: Projection alignment for the metallization of highly integrated circuits

A multilayer metallization interconnection system with a layer sequence of Pt Si-CO-SiO2-Ti-Pt-An was developed. The high quality of the metallization system is documented by life test results. The performance of the complete technology is shown by the realization of an IEZL design with a high packing density. The system is suitable for bipolar integrated circuits, but due to high costs it is only meaningful in cases with high metallization requirements. The projection alignment system, appropriate to a production process and with optical and technological performances suitable for a double layer interconnection, was tested.