Assembly technology
Abstract
Laboratory procedure governing the mounting of electronic components is specified with relation to space projects. The domain of application covers: assembly materials and accessories (fixtures, holders, wrapping, glues, varnishes, potting compounds) assembly elements (printed circuits, wire, cables, connectors) assembly techniques (soldering, crimping, wiring, stripping) and microelectronic techniques (thin film hybrid circuits, thick film). The choice of materials, elements, and technology is explained. Quality control during assembly is discussed. Assembly procedure flow charts concerning printed circuits are offered as examples. Space qualification of assemblies is illustrated and failure modes are studied.
- Publication:
-
The Technology of Spaceborne Sci. Expt.
- Pub Date:
- 1981
- Bibcode:
- 1981tsse.nasa..659L
- Keywords:
-
- Assembling;
- Equipment Specifications;
- Spacecraft Electronic Equipment;
- Failure Modes;
- Microelectronics;
- Mounting;
- Procedures;
- Quality Control;
- Electronics and Electrical Engineering