Development of test structures for characterization of the fabrication and performance of radiation-hardened Charge-Coupled Device (CCD) imagers
Abstract
Test structures and test methods for the characterization of radiation-hardened charge coupled devices (CCD) imagers were evaluated. The results of measurements on CCD imager wafers using the surface-channel and buried-channel, integrated gated-diode electrometers, before and after exposure to Co60 radiation, and using the cross bridge/electrical alignment test structures are reported. Examples of cross sections of the CCDs made by beveling and staining are also presented.
- Publication:
-
Annual Report
- Pub Date:
- August 1981
- Bibcode:
- 1981nbs..reptR....C
- Keywords:
-
- Charge Coupled Devices;
- Imaging Techniques;
- Performance Tests;
- Cross Sections;
- Microchannels;
- Quality Control;
- Radiation Hardening;
- Electronics and Electrical Engineering