Method of making V-MOS field effect transistors utilizing a two-step anisotropic etching and ion implantation
Abstract
A method of making V-MOS field effect transistors is disclosed wherein a masking layer is first formed over a surface of a crystalline substrate. An aperture is then formed in the masking layer to expose the surface of the substrate. An anisotropic etchant is applied to the exposed surface so that a groove having a decreasing width within increasing depth is formed. However, the etch is not allowed to go to completion with the result that a partially formed V-shaped groove is formed. Ions are accelerated through the aperture for implantation in the crystalline substrate in the lower portion of the partially formed V-shaped groove. Thereafter, an anisotropic etchant is reapplied to the partially formed V-shaped groove, and the etch is allowed to go to completion.
- Publication:
-
National Aeronautics and Space Administration Report
- Pub Date:
- June 1981
- Bibcode:
- 1981nasa.reptQ....J
- Keywords:
-
- Etching;
- Field Effect Transistors;
- Ion Implantation;
- Metal Oxide Semiconductors;
- Diffusion;
- Etchants;
- Fabrication;
- Patents;
- Photoconductors;
- Substrates;
- Electronics and Electrical Engineering