Predicting performance of forced air cooled heat sinks
Abstract
The concept of fin efficiency has been extended to account for the effect of temperature variation in the bases of heat sinks for power semiconductors. Extension of this concept provides a convenient and useful tool for designers interested in assessing the effects of dimensional and material changes on heat sink performance.
- Publication:
-
Heat Transfer in Electronic Equipment
- Pub Date:
- 1981
- Bibcode:
- 1981htee.proc...49W
- Keywords:
-
- Air Cooling;
- Cooling Fins;
- Heat Sinks;
- Performance Prediction;
- Temperature Distribution;
- Calculators;
- Conductive Heat Transfer;
- Finite Element Method;
- Semiconductor Devices;
- Thermal Resistance;
- Thyristors;
- Fluid Mechanics and Heat Transfer