Thermally optimum spacing of vertical, natural convection cooled, parallel plates
Abstract
Vertical two-dimensional channels formed by parallel plates or fins are a frequently encountered configuration in natural convection cooling in air of electronic equipment. In connection with the complexity of heat dissipation in vertical parallel plate arrays, little theoretical effort is devoted to thermal optimization of the relevant packaging configurations. The present investigation is concerned with the establishment of an analytical structure for analyses of such arrays, giving attention to useful relations for heat distribution patterns. The limiting relations for fully-developed laminar flow, in a symmetric isothermal or isoflux channel as well as in a channel with an insulated wall, are derived by use of a straightforward integral formulation.
- Publication:
-
Heat Transfer in Electronic Equipment
- Pub Date:
- 1981
- Bibcode:
- 1981htee.proc...11B
- Keywords:
-
- Convective Heat Transfer;
- Electronic Packaging;
- Finned Bodies;
- Free Convection;
- Parallel Plates;
- Thermal Environments;
- Two Dimensional Flow;
- Energy Dissipation;
- Laminar Flow;
- Optimization;
- Plate Theory;
- Spacing;
- Fluid Mechanics and Heat Transfer