Curvilinear printed circuit boards in airborne scientific instrumentation for space use
Abstract
In order to minimize the size and weight of airborne instrumentation and reduce the number of soldered interconnections, it is proposed to use printed circuit boards of complex curvilinear profiles. A process for the manufacture of curvilinear printed circuit boards is described which involves the following principal stages: (1) fabrication of a flexible printed circuit board, (2) fabrication of a stiff base having the required profile, (3) bonding of the printed circuit board to the base, (4) installation of interconnectors, and (5) wiring
- Publication:
-
Development of Scientific Instruments for Space Use
- Pub Date:
- 1981
- Bibcode:
- 1981dsis.book..116V
- Keywords:
-
- Airborne Equipment;
- Avionics;
- Circuit Boards;
- Instrument Packages;
- Printed Circuits;
- Cylindrical Bodies;
- Fabrication;
- Sandwich Structures;
- Electronics and Electrical Engineering