Increasing the wiring density of multilayer printed circuit boards for airborne scientific instrumentation
Abstract
Design improvements are proposed for multilayer printed circuit boards manufactured by the method of open bonding pads which make it possible to reduce the volume of electronic blocks and the number of layers in the printed circuit board. The proposed improvements include the use of double wells for interlayer connection and overlap soldering of small radioelectronic elements.
- Publication:
-
Development of Scientific Instruments for Space Use
- Pub Date:
- 1981
- Bibcode:
- 1981dsis.book..113P
- Keywords:
-
- Airborne Equipment;
- Avionics;
- Circuit Boards;
- Instrument Packages;
- Printed Circuits;
- Design Analysis;
- Dielectrics;
- Sandwich Structures;
- Electronics and Electrical Engineering